Vacuum Plasma Treater | VacuTEC 5050
FEATURES: | |
Easy to install and use | Connect to mains power. |
Fast treatment times | High power impact enables treatment times from 5 – 600 seconds, depending on material. |
Vacuum level | The plasma discharge is active from 0,1 – 3 mbar depending on application. |
Process gas | Process gasses such as oxygen and argon can be used, but in most cases it is not necessary. |
Process control | The entire plasma process is controlled by the HV-X generator and the PLC unit. All parameters are displayed through the touch panel. |
Cost efficient surface treatment |
Due to the low power consumption and no need of special treatment gasses the unit is a very cost efficient solution for improving surface wettability and adhesion. |
Vacuum pressure Plasma | Enables treatment of both conductive and non-conductive surfaces. |
Chamber door | Hinged door with window and safety switch. |
Technical Specifications | VacuTEC 5050 | Vacuum Plasma Treater |
Mains voltage and frequency | 100-480 VAC 50/60 Hz |
Output voltage/plasma power | 5kV / 1000W |
Power source | HV-X10 Generator |
Compressed air inlet | 6 bar dry & clean |
Treatment gas | Standard: air, oxygen, argon, nitrogen on request |
Vacuum pump capacity in m³/min. | 100 m³/hour |
Vacuum level | 0,1–3 mbar |
Evacuation time, typical | 90 seconds |
Plasma treatment time, typical | 5 – 600 seconds, depending on material |
Control and connectivity | Complete with Tantec touch panel. |
Regulation compliance | CE – RoHs – WEEE |
Dimensions | 1115 x 955 x 1745 mm |
Shelves | 2 |
Tray size | 500 x 500 mm |